Call for Proposals: Colloquia Ceranea

First Colloquia Ceranea International Conference, Łódź, Poland, 11-13 April 2019

Deadline: 30 November 2018

On behalf of the Organizing Committee of the Colloquia Ceranea international scholarly conference, we are proud to announce that the call for proposals is open. The conference will take place April 11–13, 2019 in Łódź (Poland).

We intend for the Colloquia Ceranea to become an annual gathering of scholars who study the history and culture of several geographic areas (Byzantium, the Slavic world, the Balkans, the Middle East, and the Caucasus) throughout a number of historical periods (ranging from Antiquity through the Middle Ages to the Early Modern period), with a particular focus on:

•material culture and everyday life,
•historical and political geography,
•peace and war studies,
•society, mores and social norms,
•literature, manuscript production and circulation,
•art and visual culture,
•cultural unity and diversity, continuity and innovations,
•the history of the Church and religious movements,
•political culture and ideology,
•historiography and perception of the past from Antiquity to the present,
•the state and its organization.

We are deeply convinced that the event will result in lively discussion and an invigorating exchange of ideas, leading to genuine intellectual interaction – perhaps the key element of any scholarly conference. Accordingly, we have opted for a format based on thematic panels, led by moderators who will represent groups of participants of each particular scheduled meeting. We expect these panels to consist of a maximum of 4 speakers, with each panel session lasting 1 hour and 45 minutes. Individual submissions are also welcome.

Papers should be presented in English. Other languages are acceptable too, provided that the speaker prepares an English handout (or multimedia presentation) outlining the main points of the talk.

Declarations regarding the topics of the panels and lists of speakers should be sent by November 30, 2018 to the e-mail address

For full details, see